On October 22nd, 2021, the three-day 2021 NEPCON Asia  Exhibition ended successfully. As a famous professional exhibition in Asian electronics manufacturing industry, this year's NEPCON ASIA has an exhibition area of 70,000 square meters, gathered more than 1,200 exhibitors, and more than 30 events were brilliantly shown, presenting the latest cutting-edge products and innovative technologies in the world on the spot, attracting the participation of many people in the industry and audiences. 
 
 

Shenzhen HB Technology Co., Ltd. was invited to participate in this exhibition, who brought high-quality vacuum reflow oven, high-cleanliness heating/curing equipments, automatic wave soldering and other solutions to the electronic manufacturing industry, and was enthusiastically consulted and widely praised by new and old customers. 

HB has been focusing on technological innovation in the field of heating, and this exhibition focuses on high-end welding equipment and semiconductor curing equipment. In view of the requirements of high precision, high reliability and high cleanliness in the semiconductor industry, HB has made continuous efforts with strong R&D strength, rich process experience and innovative spirit to bring solutions that can replace imported equipment for the development of domestic semiconductor industry.