Haobao semiconductor chip clean curing oven

The importance of the camera in the smart phone is increasing, and the performance of the camera is inseparable from the continuous evolution of the camera chip.

However, the chip is increasingly thin and short, and the demand is increasing, and the traditional packaging and curing process and equipment can not meet the strict requirements of chip curing. How to ensure the high quality, high yield and high efficiency of camera chip packaging and curing?

A few days ago, the R&D team of Shenzhen Haobao Technology Co., Ltd. successfully developed the first domestic dual-track clean curing oven for semiconductor chips, effectively solving the packaging and curing problem of camera chips.

This kind of semiconductor chip clean curing furnace is composed of three parts: front and back connection machine, heating and curing main machine and control electrical box. According to the company's R & D engineers, the equipment mainly has the following characteristics:

1. High curing quality

The main body of the equipment adopts segmented independent heating, the oven has 1 preheating zone, 5 heating zones and 2 cooling zones, and adopts advanced PID closed-loop temperature control technology, the temperature control accuracy can reach ±1℃, and the maximum temperature can be set at 300℃. The adjacent heating zone does not cross temperature, and the maximum temperature difference can reach 100℃, which meets the temperature curve requirements of various semiconductor chip glue encapsulation and curing process after coating;

High clean air duct design in the furnace, and the use of advanced multiple filtration system, the production of the oven environment can reach 100 levels of cleanliness, to meet the needs of dust-free production; The cooling area uses an efficient water cooling system, and the temperature can be reduced to about 50℃ when the product is output.

2. High production efficiency

Unique stepping double-track handling system, using SSR drive, automatic double-line efficient production, accurate and fast transportation, production capacity is twice that of monorail, according to 24pcs per piece, UPH can reach 4000pcs.

3. Small footprint

The overall design and layout of the equipment is scientific and reasonable, the overall fuselage is 1.4m long, 1.8m wide, 1.7m high, and only one person high (2.1m high after the product is raised during maintenance), which is smaller than the traditional curing oven, which can greatly reduce the floor area and facilitate the intensive planning and management of the production line.

4. Easy management and maintenance

The semiconductor curing equipment is equipped with Haobao intelligent control system and MES system, which can monitor and automatically record the temperature of each temperature zone in real time, display the temperature curve in real time and collect the data such as the plate, and make the production management more convenient.

The host adopts the lifting design, the connection machine adopts the push-pull design, and the control electric box can be turned over 90 ° C, which makes the equipment more convenient and fast in daily maintenance and overhaul, without the need for overall disassembly and assembly, saving maintenance time, maintenance costs and waiting time.

Haobao semiconductor chip clean curing oven can be used for the encapsulation and curing of semiconductor chips such as cameras, with the advantages of high quality, high yield, high productivity and small footprint. It is understood that the equipment has been adopted by the world's top 500 enterprises.