With the great development of the global electronics industry, more and more product processes require the use of laminating, bottom filling, perfusion sealing or coating processes. However, in the above process, bubbles or holes are often produced in the laminating surface, glue or silver paste, resulting in poor product sealing and poor heat loss, seriously affecting product reliability and consistency, reducing yield, and even causing functional failure of electronic components and quality accidents. How to effectively eliminate bubbles in the process? The vacuum pressure defoaming oven launched by Haobao Technology R & D team has the advantages of fast defoaming, high cleanliness and easy operation.

Haobao vacuum pressure defoaming oven can be used in chip bonding (DAF), screen bonding (OCA), Underfill, Potting or Printing coating in semiconductor, 5G communication, new energy, automotive electronics, consumer electronics, aerospace and military industries. It can effectively eliminate bubbles, increase adhesion and sealing, and improve product yield, consistency and reliability.