Haobao attended the CEIA Summit Forum in Hangzhou to share solutions for vertical curing ovens in the field of IGBT and Mini LED

Release time : 2022-08-20 Reading volume:66 Printing Collection

On August 10, 2022, the 80th CEIA Electronic Intelligent Manufacturing Summit Forum was successfully held in Crowne Plaza Longfor Hotel, Hangzhou, Zhejiang. As a leader in the field of electronic manufacturing welding and curing equipment, Haobao Technology was invited to participate in this summit forum and bring a keynote speech. Experts, scholars, technical and business people from Hangzhou and the Yangtze River Delta gathered together for cross-border exchanges and dedicated a high-quality industry event for everyone.



The speaker of the Haobao Wang Xun, is Haobao Hangzhou Office business director, but also a senior equipment engineer, has many years of reflow welding, wave soldering and spot solidification process solution ability and practical application experience. He gave a detailed introduction to the development of new energy vehicle IGBT and Mini LED display fields, package curing requirements and related solutions.



In the context of global "dual carbon", the development of new energy electric vehicles can be described as unstoppable. New energy vehicles need more chips than traditional fuel vehicles, and IGBT chip is one of the core chips, it is a high-power power electronic device, is an on-off switch, widely used in motor controllers, on-board chargers (OBC), on-board air conditioners and DC charging piles for new energy vehicles. The main role of IGBT in electric vehicles is to convert direct current into frequencially adjustable alternating current for motor use, which determines key performance indicators such as the torque and maximum output power of the electric vehicle drive system, which can be called the "heart" of new energy vehicles.





IGBT module packaging requires dispensing and curing process, curing equipment is mainly used for IGBT module production process side frame glue module and silicone module glue curing. However, the traditional curing process for the module needs to manually put the product into or out of the oven, which is not only a large workload, low efficiency, but also has inconsistent curing quality, and high temperature is easy to cause personnel to be burned by misoperation.

The IGBT module automatic HVO clean vertical curing furnace developed and produced by Haobao can realize the IGBT module automatic loading and unloading and efficient baking, effectively improve the work efficiency, improve the consistency of the product, and effectively avoid the situation that the high temperature of the cured product is easy to cause personnel to be burned. Haobao's vertical curing equipment is cost-effective, only one-third of the imported equipment; High precision temperature control, high cleanliness, no card, can meet the diversified production needs of different sizes of products.





In this summit forum, the speeches and sharing of Haobao technology were full of dry goods, and were praised by the experts, technical personnel and business life. Outside the venue, on the small booth of Haobao, there was an endless stream of people consulting and communicating.







Haobao Technology participated in the CEIA electronic intelligent Manufacturing Summit Forum in Hangzhou, China, and achieved a complete success.

If you are interested in the process and application of HObo's vertical curing oven, please contact Hobo technical personnel in various regions for further understanding.