On December 22, 2022, this day is the Winter Solstice Festival, marking the coming cold season, and the folk began to calculate the cold day. But on this day, the southern Shenzhen Haobao Industrial Park is very lively and warm. The signing ceremony of Haobao Technology to hire Dr. Wu Yiping, professor and doctoral supervisor of Huazhong University of Science and Technology, as the company's "chief consultant" was successfully held at the square in front of the Haobao Administrative Building.

Mr. Li Jinhui, Chairman of Haobao Technology, Mr. Luo Wenxin, General manager, Mr. Liang Congyuan, Deputy General Manager of Research and development, Mr. Xiao Zhijian, Deputy General manager of Administration, and relevant employees attended and witnessed the signing ceremony, and carried out speeches, exchanges and other activities.

Luo Wenxin, General manager of Haobao Technology, signed the Principal consultant agreement with Professor Wu Yiping on behalf of the company. And to Professor Wu issued a letter of appointment. President Luo expressed his warm welcome and sincere thanks to Professor Wu Yiping for choosing Haobao and being appointed as "Chief Consultant". He believes that with Professor Wu's guidance and help, he will certainly play a positive role in promoting the strategic layout and long-term development of our company.

Mr. Luo pointed out that the cooperation between Haobao and Professor Wu can be said to be a strong alliance, and the history of Haobao will start to turn a new page today. Through this signing, we will sincerely join hands, complementary advantages, technology and product based, research and development of electronic manufacturing equipment in the field of jam neck technology, innovative development of electronic assembly and packaging of advanced equipment and technology, improve the reliability of China's electronic manufacturing equipment, intelligent and green level, unswervingly adhere to create value for customers, Excellent heating equipment and solutions for society.

Professor Wu Yiping said that today I am very happy to join the Haobao family; After many in-depth communication and site inspection with Haobao in the early stage, we believe that Haobao is an excellent company with steady development, strong R&D strength and technical accumulation. The team of Haobao is down-to-earth, full of ideals and brave in innovation. In the future, I am willing to work with my colleagues in Haobao in terms of strategic layout, technological innovation and product research and development, and on the basis of doing a good job in the field of SMT heating welding and curing equipment, further go further and do better in the fields of advanced electronic packaging and third-generation semiconductors.

After the simple and grand signing ceremony, Professor Wu Yiping was invited to give a speech on "Electronic manufacturing Technology" for Haobao management and technical backbone, and introduced the evolution process and development route of electronic manufacturing technology, as well as the basic process and technology development in electronic packaging, semiconductor and other fields. After the meeting, Professor Wu had an exchange and discussion with everyone, and agreed on the time and general content of the next exchange.

Introduction of Professor Wu Yiping

Yiping Wu, male, Doctor of Engineering, Professor and doctoral supervisor of School of Materials Science and Engineering, Huazhong University of Science and Technology, Professor of Wuhan National Laboratory of Optoelectronics; Chief Professor, South China Semiconductor Optoelectronics Research Institute, Guangdong; Distinguished professor, Wuyi University. For a long time, he has been committed to the teaching and scientific research in the fields of iron and steel materials, material forming processing, surface engineering, electronic and optoelectronic manufacturing, electronic packaging technology and integrated circuit manufacturing, and has published more than 130 academic articles and nearly 100 scientific science technical articles. He has obtained more than 10 patents. He has published 4 monographs such as "Fundamentals of Electronic Manufacturing Technology", "Surface Engineering" and "Electronic Assembly Technology", and participated in the compilation and publication of many other monographs and teaching materials. His research achievements have won national and provincial science and technology achievement awards and provincial teaching achievement awards for many times. He has presided over 6 national major special projects, 863 projects, National Natural Science Foundation projects and dozens of provincial and ministerial scientific research projects and horizontal projects. He was also a research fellow at the Department of Electronic Engineering, City University of Hong Kong; Adjunct Professor, Shanghai Jiao Tong University and Beijing Institute of Technology. He is a famous expert and scholar in the field of electronic packaging, and is also one of the founders of the undergraduate program of electronic packaging technology in China.

In 1995, Professor Wu Yiping turned his research direction to the field of microelectronics manufacturing, and founded the Electronic Packaging Laboratory and the Microsystem Center of Huazhong University of Science

and Technology. In the future very promising flexible electronic packaging technology and equipment and other fields of pioneering research. The idea of desktop manufacturing of small scale and even single electronic board is put forward. He served as the Secretary-General of the Analysis and Testing Center of Huazhong University of Science and Technology (2000-2004), the Deputy Director of the Department of Materials Science and Technology of Huazhong University of Science and Technology (1996-2006), and the Deputy Director of the MEMS Center of Huazhong University of Science and Technology (2001-2005).

From 1997 to 1999 and from 2002 to 2003, he was employed as a researcher in the Department of Electronic Engineering, City University of Hong Kong, engaged in advanced electronic packaging and assembly research, focusing on the packaging structure and reliability research of SMT, BGA, FLIP-CHIP, MCM, COB, etc. In 1998, he assisted the university in applying for the largest grant research program of the Hong Kong government to the university, and established the Electronic Packaging and Assembly Reliability and Failure Analysis Center (EPA Center), which has developed into several famous packaging research centers in the world today.

Haobao technology introduction

Shenzhen Haobao Technology Co., LTD., founded in 2010, is a professional R & D, production and sales of lithium battery vacuum drying line, high vacuum oven, contact cell preheating tunnel oven and reflow, vertical curing oven, semiconductor welding curing oven and other automation equipment company.

Haobao Technology is committed to becoming a global leader in heating equipment, providing high-quality and efficient solutions for global electronic processing and new energy industries, and providing customers with systematic and worry free services. Haobao company has a strong independent R & D innovation, engineering design and manufacturing and technical service capabilities, with more than 100 R & D, technical engineers, has been rated as the national high-tech enterprises for many years, in 2022 was rated as Shenzhen specialized special new enterprise.

Haobao company pays attention to the international strategic layout, and has built a marketing network in many countries and localities around the world. We have established a sales and service network in Southeast Asia, Europe, America and Australia. At the same time, Haobao has branches or offices in Beijing, Shanghai, Guangzhou, Hangzhou, Suzhou, Qingdao, Chengdu, Chongqing, Wuhan, Zhengzhou and Hong Kong.

Haobao's market share in the world is rising, Haobao's high-end nitrogen reflow furnace, clean vertical curing furnace, semiconductor chip curing furnace, vacuum drying line and other equipment has been adopted by many customers including Huawei, Foxconn, BYD, Flextronics, Bosch Automobile, Continental Automobile, Huichuan, LAN Si, OPPO, Xinwang Da, New energy and so on.