Wuhu, Anhui Province, is the second city of Anhui Province, located in the eastern part of the south of Anhui Province, the Yangtze River through the city, is a river and water town, is a veritable C city in the south of Anhui Province, Sun Yat-sen praised as "the great port of the Yangtze River, the backbone of Anhui".

From May 30 to 31, 2023, the third CIAS2023 Automotive power Semiconductor Innovation Forum was successfully held in Wuhu, Anhui Province, the theme of this forum is "strong core stable chain, build ecology", focusing on the supply chain construction and domestic development of automotive power semiconductor. Shenzhen Haobao Technology Co., Ltd. was invited to participate in the forum.

In response to the stringent requirements of high-efficiency heat dissipation, high reliability and long life of car-gauge power semiconductors, Haobao has developed and launched IGBT module packaging vacuum welding furnace and high cleanliness nitrogen curing furnace, which have been widely concerned and praised by participants. With outstanding equipment performance parameters and successful customer cases, Haobao was awarded the title of "2023 Semiconductor Seal Test Quality Supplier" by the conference.

Some of Haobao semiconductor packaging equipment:

The HV series vacuum reflow oven developed by Haobao Technology research and development team has super vacuum capacity, reducing the welding cavity rate by more than 90%, and greatly improving the reliability of solder joints; Efficient heating, accurate temperature control, heating up to 400℃, temperature control accuracy ±1℃, high production efficiency.

Application: Suitable for high precision, high reliability requirements of semiconductor, automotive electronics, aerospace, national defense military and medical fields.

The HY series semiconductor reflow welding oven created by the elite R&D team of Haobao Technology has a maximum operating temperature of 400℃ and a temperature control accuracy of ±1℃, fully meeting the needs of lead-free process; The whole process is covered with nitrogen, and the residual oxygen is controlled within 50ppm, effectively avoiding the oxidation of electronic components; Thousand degree of cleanliness, to meet the requirements of clean workshop; The equipment has high long-term operation reliability, high cost performance and low comprehensive operating cost.

Application: Widely used in flip chip, embedded chip, wafer level semiconductor packaging and other processes.

For IGBT module traditional packaging and curing equipment automation degree is not high, easy to cause device oxidation, cleanliness is difficult to effectively control, resulting in low yield, low efficiency, high cost and other problems, Haobao research and development of IGBT module packaging dedicated to high purity nitrogen vertical curing and cooling integrated oven, can be fully automatic online production, full nitrogen, good temperature uniformity. High cleanliness, for IGBT power semiconductor companies to bring a new solution.

Application: Suitable for IGBT module, MOSFET module, SiC module and other power semiconductor device module dispensing, coating and potting after baking, curing.

In response to the semiconductor industry's packaging requirements for equipment with high cleanliness, low vibration and high temperature control accuracy, Haobao has developed and launched this automatic online semiconductor packaging 100-level clean vertical curing oven, with cleanliness up to Class100, vibration amplitude ≤100um, transportation accuracy up to ±0.18mm, temperature control accuracy ±1 degree. It can store 60-240 layers of boards or vehicles, can monitor the temperature in real time and generate temperature curves, and can be connected to the MES system to achieve unmanned and intelligent management.

Application: It is suitable for curing, aging and other processes in semiconductor, sensor, mobile phone camera, automotive electronics, aerospace, military and medical fields.