Now the managers or bosses of electronic manufacturing and semiconductor packaging factories often encounter such troubles: the production efficiency of the factory or workshop is low, the product pass rate is low, the equipment energy consumption is high, the equipment covers a large area, and the area of the factory or workshop is limited, and the production line requires more labor, and the labor cost is high...

What should I do when I encounter these problems? Is there a better solution for packaging production lines such as glue baking and curing equipment? For example, if you want the curing equipment to be smaller, more economical, more labor-saving, convenient information and digital management, the baking and curing quality is higher, the consistency is better, the equipment is more environmentally friendly, energy-saving and so on. And around more and more factories choose vertical curing furnace, which is a kind of equipment? What are the characteristics or advantages?

On September 15, 2023, the Step by Step New Technology Seminar will be held in Crowne Plaza Chengdu New Hope High-tech Hotel. Haobao Technology will be invited to attend the meeting, and Mr. Kang Tao, business manager of Southwest Region of Haobao, will share the dry goods of "Process and application of vertical furnace in semiconductor curing and other fields".

If you want to take part in the Chengdu step by step meeting or come to learn, exchange people, please scan the code to sign up for the space oh.