With the development of science and technology, the demand for packaging in 3C, automotive electronics and power semiconductors is growing, and advanced packaging processes in automotive electronics and power semiconductors require high-quality curing equipment. In order to solve the problems of unstable quality, much labor and large footprint of traditional curing equipment, Haobao takes the lead in launching automatic vertical curing solutions in China, breaking the monopoly of vertical heating technology abroad, empowering the intelligent, automatic and low carbonization of baking curing process, so that Chinese manufacturing can reach a new level.

On November 17, 2023, Haobao will attend the 108th CEIA China Electronics Intelligent Manufacturing Seminar in Shanghai, and Mr. Wang Lixing, sales manager of Haobao East China District, will give a speech sharing on the application of vertical curing Furnace in Automotive Electronics & Power Semiconductors.

Haobao took the lead in introducing vertical curing solutions in China in 2013, and now has launched a variety of transportation structures, different heating temperatures, hundred/thousand/ten thousands degree of cleanliness and nitrogen and other atmosphere control vertical curing furnaces, with the most advanced, complete and stable solutions and customer batch use cases in the field of vertical curing furnaces in China. Widely used in automotive electronics, power semiconductors, 3C, Mini LED, aerospace, military, medical and other fields of dispensing, coating, potting glue and other processes of drying and curing.