HB auto Vacuum Reflow Oven for high quality products request

Product Introduction

2. It is suitable for semiconductor, aerospace, national defense and military industry, medical care, automotive electronics, 5G communication, LED and other fields with high precision and ultra-high requirements.

3. Efficient heating, precise control, patented structure and heating technology, heating up to 400 ℃, temperature control accuracy ±1℃

4. Strong vacuum capacity, can reduce the void rate by more than 90%, and greatly improve the reliability of solder joints.

5. The unique structural design of the vacuum chamber, the vacuum upper cover will be opened when the top chamber opened, which is easier to maintain.

6. Vacuum zone is no longer blind, real-time monitoring temperature and vacuum degree, easy to adjust temperature profile, maintain high soldering stability of products.

Principle of vacuum soldering

1. Conditions for introducing vacuum

Vacuum soldering technology is a kind of reflow soldering technology which introduces vacuum environment into reflow soldering process. After the product enters the reflow zone, a vacuum environment is created to improve the welding quality.

2. Remove bubbles by pressure difference

The external environment of solder joints in molten state is close to vacuum. Because of the pressure difference between inside and outside the solder joints, bubbles in the solder joints overflow, which greatly reduces the void rate of solder joints and improves the reliability of solder joints.

Core technology & Advantages

Super strong vacuum greatly reduces void rate

1. Super strong vacuum capacity, as low as 1 torr vacuum, can greatly reduce the void rate, improve the reliability of solder joints. According to customer's  test, the lowest void rate can reach 0.02%, and the solder joint is reliable.

No temperature drop in vacuum zone

2. The vacuum chamber is three-dimensional insulated, and medium-wave infrared heating compensation is adopted to prevent temperature drop, and the solder quality and yield are higher.

Unique triple induction technology

3. The front, middle and rear triple induction technology effectively prevents the pressure plate and clamping plate when the vacuum chamber is closed, and the production is more intelligent and assured.

Real-time monitoring in vacuum zone

4. Vacuum zone is no longer blind, real-time monitoring of temperature and vacuum can be equipped with a special temperature tester, easy to adjust the profile, maintain the stability of soldering products.

Specification

HB Full-auto Vacuum Reflow Oven