In the context of the global "dual carbon", the rapid development of the new energy industry, electric vehicles, charging piles, photovoltaic and other markets for IGBT power semiconductor chips and modules demand ushered in explosive growth.

IGBT refers to the insulated gate bipolar transistor chip, is currently the most mature and most widely used power device in high-power switching components, both MOSFET high input impedance and GTR low on-voltage drop of two aspects of the advantages, driving power is small and saturated voltage reduction, is the core device of energy conversion and transmission, known as "the heart of electronic power device", The potential for development is huge.

IGBT module is a modular semiconductor product composed of IGBT (insulated gate bipolar transistor chip) and FWD (continuous current diode chip) through a specific circuit bridge package. The packaged IGBT module is directly applied to the inverter, UPS uninterruptible power supply and other equipment, it has the advantages of large input impedance, small driving power, simple control circuit, small switching loss, fast on-off speed, high working frequency, large component capacity and so on.

The development trend of IGBT is high voltage, high current, high speed, low voltage drop, high reliability and low cost. In particular, the development and application of high-voltage inverter, simplifying its main circuit, reducing the use of devices, improving reliability, reducing manufacturing costs, simplifying debugging work, etc., are closely related to IGBT.

In the IGBT industry, the safety and stability requirements of vehicle gauge chips and modules are higher, the research and development cycle is long, the technical threshold is high, and the capital investment is large, so the development of vehicle gauge chips and modules is also facing more challenges.

The packaging of IGBT module is more difficult, its pain points are mainly low packaging efficiency and low yield, the reason is mainly that the automation degree of packaging equipment is not high, the device is prone to oxidation during the packaging process, the temperature uniformity and cleanliness are difficult to effectively control, resulting in the consistency of packaging module production is reduced, and the cost is high.

In view of the above pain points, Haobao technical team has developed a vertical curing oven specially used for IGBT module packaging, which can be fully automatic production, avoid device oxidation, good temperature uniformity, high cleanliness, and bring high efficiency and high yield solutions for IGBT power semiconductor packaging manufacturers.

According to reports, the core technical advantages and characteristics of this IGBT module packaged by Haobao vertical curing furnace are as follows:

1. Fully automatic production and management, greatly reducing labor.

The equipment adopts modular structure to realize automatic and online production, such as loading and unloading, baking, cooling, caching, etc., with high production efficiency, and the production capacity can be increased or adjusted according to customer needs. It avoids a number of drawbacks of the traditional packaging process, such as the traditional baking and curing equipment requires manual operation, large workload, low efficiency, inconsistent curing quality, high temperature is easy to cause personnel burns and other problems.

2. Low residual oxygen to avoid device oxidation

The equipment adopts a unique structural design and has applied for invention patents, which can ensure that the residual oxygen is controlled within 1000PPM in the process of transmission, heating, cooling and caching, effectively avoiding the oxidation of heat-sensitive devices such as metals.

3. High cleanliness, to meet the requirements of dust-free production

The equipment is well sealed, and adopts an efficient filtration and cleaning system, making the packaging process reach a thousand degree of cleanliness and meet the requirements of dust-free production.

4. High temperature uniformity, good production consistency

The equipment adopts excellent heating and temperature control module and unique air duct and cavity design, which can ensure high heating efficiency and uniform and stable temperature, so that the baking and curing are uniform and the production is consistent.

Haobao successfully developed this IGBT module automatic vertical curing oven, breaking through a number of key technical difficulties, the price is only one third of foreign imported equipment, for power semiconductor manufacturers to provide more cost-effective packaging curing equipment and solutions, is IGBT manufacturing, packaging manufacturers rare Gospel.