In recent years, with the increasingly mature LED display technology, the development prospects of Mini LED and Micro LED are widely optimistic, and the future market space is broad.

The chip size of the Mini LED is between 50 and 200μm, and the chip size of the Micro LED is within 50μm, which is essentially LED technology, and the manufacturing process of the LED chip is basically the same, however, its manufacturing and packaging has put forward higher requirements for related equipment and processes. Because of its smaller chip size, smaller point spacing and more chips per unit area, it is difficult to transfer, welding, dispensing and curing, so the overall yield of the Mini/Micro LED industry is low and the cost is high, which hinders the further development of its commercialization and industrialization.

At present, Mini LED is mainly divided into direct display and backlight, and there are two main links in the packaging need to be baked and cured: 1. Baking and curing of the bottom of the direct display and the filling of the caulking glue; 2. Baking and curing of back display dam and dome encapsulation process.

The curing process of Mini LED has high requirements for the transportation smoothness, cleanliness, temperature uniformity and intelligent management of the equipment. However, the ordinary baking and curing furnace on the market is difficult to effectively meet the above requirements, and the packaging often causes the Mini LED display module to have water ripples, bubbles or holes, and the number of dust particles exceeds the standard, which seriously affects the reliability and yield.

Haobao technology carefully developed HFZ series Mini LED package curing furnace, specially for Mini LED, with smooth transportation, high cleanliness, uniform temperature control, intelligent management and other characteristics, effectively solve the packaging prone to water ripples, bubbles, dust pollution and other pain points, has been adopted by a number of Mini LED head enterprises. Greatly improve the package curing yield of Mini LED products.

Haobao HFZ series vertical curing oven, is Shenzhen Haobao Technology Co., Ltd. R & D team dedicated to Mini LED packaging curing process to create high-end, high-quality equipment. It uses Haobao advanced heating, cleaning and automation technology, efficient heating, accurate temperature control, stable and reliable transportation, high cleanliness, good curing quality, to meet the process requirements of Mini LED production and packaging.

Core technologies and advantages are:

1, Automation, intelligence: the use of unique design structure and intelligent management system, segmented heating, intelligent temperature control, to meet the unique Mini LED debubbling, cavity and other process needs.

2, Smooth transportation, low vibration: the use of advanced transportation structure design and guide rail materials, accurate and stable automated transportation, vibration amplitude is reduced by 4 times compared with the traditional, effectively reduce the displacement of precision components due to vibration, water ripples and other bad and loss.

3, Excellent temperature control performance: The use of Haobao 12 years of profound accumulation of heating, temperature control technology, temperature control accuracy of ±1℃, good temperature uniformity in the furnace, the measured temperature difference in the same area is only within ±3℃, making baking, curing quality more stable and reliable.

4, High cleanliness, to meet the requirements of dust-free: the use of Haobao cleaning technology, the overall equipment can reach 10,000 or thousands of clean production requirements. Laminar air duct optimization design, superimposed efficient filtration technology, to ensure the LED chip in the packaging and curing process of high cleanliness, to avoid dust pollution, quality is more guaranteed.

For more details, please contact Haobao Technology business and service personnel.