In the context of the global "dual carbon", the rapid development of the new energy industry, electric vehicles, charging piles, photovoltaic and other markets for IGBT power semiconductor chips and modules demand ushered in explosive growth.

Global "dual carbon" new energy is developing rapidly

IGBT refers to the insulated gate bipolar transistor chip, is currently the most mature and most widely used power device in high-power switching components, both MOSFET high input impedance and GTR low on-voltage drop of two aspects of the advantages, driving power is small and saturated voltage reduction, is the core device of energy conversion and transmission, known as "the heart of electronic power device", Development potential

New energy vehicle IGBT module

IGBT module is a modular semiconductor product composed of IGBT (insulated gate bipolar transistor chip) and FWD (continuous current diode chip) through a specific circuit bridge package. The packaged IGBT module is directly applied to the motor drive, inverter, UPS uninterruptible power supply and other equipment, it has the advantages of large input impedance, small drive power, simple control circuit, small switching loss, fast on-off speed, high working frequency, large component capacity and so

IGBT module structure splitting diagram

IGBT module package structure diagram

The development trend of IGBT is high voltage, high current, high speed, low voltage drop, high reliability and low cost. In particular, the development and application of high-voltage inverter, simplifying its main circuit, reducing the use of devices, improving reliability, reducing manufacturing costs, simplifying debugging work, etc., are closely related to IGBT.

The packaging of IGBT power module is more difficult, its pain points are mainly low packaging efficiency and low yield, the reason is mainly that the degree of automation of the packaging equipment is not high, the device is prone to oxidation during the packaging process, the temperature uniformity and cleanliness are difficult to effectively control, resulting in the consistency of the packaging module production is reduced, and the cost is high.

An enterprise IGBT module package manufacturing flow chart ↓

An enterprise IGBT module packaging manufacturing flow chart

In view of the above pain points, Haobao technical team has developed a vertical curing furnace specially used for IGBT module seal filling glue and silicon gel injection, which can be fully automatic production, avoid device oxidation, good temperature uniformity, high cleanliness, and bring high efficiency and high yield glue curing solutions for IGBT power semiconductor packaging manufacturers.

Haobao IGBT module online glue curing furnace

According to reports, the core technical advantages and characteristics of this IGBT module online vertical curing furnace are as follows:

First, fully automatic production and management, greatly reducing labor.

The equipment adopts modular structure and online production, realizing automatic production such as loading and unloading, baking, cooling, and caching. The UPH is high, and the production capacity can be increased or adjusted according to customer needs. It avoids many drawbacks of the traditional packaging process, such as the traditional baking and curing equipment requires manual operation, large workload, low efficiency, inconsistent curing quality, and high temperature is easy to cause personnel burns and other safety problems.

The vertical curing furnace can also be connected to the MES system to achieve Industry 4.0, remote monitoring and intelligent management of the equipment.

Haobao IGBT dispensing and filling on-line curing furnace can be connected with MES system

Haobao IGBT dispensing and filling on-line curing furnace can be connected with MES system

Second, heating, cooling full nitrogen, low residual oxygen, effectively avoid metal oxidation

The equipment adopts a unique structural design and has applied for related patents, which can ensure that the residual oxygen is controlled within 1000ppm or even lower in the transmission, heating, cooling and caching process, effectively avoiding the oxidation of copper and other metal layers, and providing the reliability of the power module.

Haobao IGBT curing furnace full nitrogen, low residual oxygen, anti-oxidation

Third, high cleanliness, to meet the requirements of dust-free production

The equipment has good airtight, adopts special structure and materials to avoid dust, and adopts multi-layer efficient filtration system to make the production process reach a thousand degree of cleanliness and meet the requirements of dust-free production.

Thousand degree of cleanliness vertical curing furnace

Fourth, high temperature uniformity, good production consistency

The equipment adopts excellent heating and temperature control module and unique air duct and cavity design, which can ensure high heating efficiency and uniform and stable temperature, so that the baking and curing are uniform and the production is consistent.

Haobao successfully developed this IGBT module automatic vertical curing furnace, breaking through a number of key technical difficulties, the price is only one-third of foreign imported equipment, for power semiconductor manufacturers to provide more cost-effective packaging curing equipment and solutions, is the IGBT manufacturing, packaging manufacturers of the Gospel.

It is reported that the equipment has been supplied to a number of head manufacturers in the IGBT industry and has been highly recognized by customers.